September 2017 edition – Vol.9 no.7


You are cordially invited to participate in the next ReSMiQ Innovation Day on October 12, 2017, at Polytechnique Montréal. This activity, organized by our center, aims to provide visibility to the research work of students from Quebec in the field of microsystems among the members of the scientific community Québec. The call for projects announced across the province of Québec has resulted in the selection of a total of 16 projects, 2 from undergraduate students and 14 from graduate students.

The candidates for the competition will demonstrate their scientific and technical expertise to a panel of judges composed of many experts. The best 3 projects in both categories will receive a cash award. RID 2017 will also be an excellent opportunity to attend keynote presentations by two renowned speakers such as Jose M. de la Rosa from the Universidad de Sevilla and Hao Yu from the Southern University of Science and Technology in Shenzhen in China. We thank all of the students who submitted their project. We invite you to visit our web site ( for more details.

ReSMiQ is a group of researchers in an interuniversity research center that can count on the support of the Fonds de recherche du Québec – Nature et technologies (FRQNT) and nine (9) Quebec universities involved in microsystems research.


– Dr. Peter from Polytechnique Montréal is the program co-chair of the Conference on Optical MEMS and Nanophotonics 2018 (OMN) to be held in Lausanne, Swizterland, on the campus of the EPFL from July 29 to August 2, 2018.
More details

– Dr. Ait Mohamed from Concordia is the general co-chair of The 31st International Conference on Industrial, Engineering & Other Applications of Applied Intelligent Systems (IAE/AIE) to be held in Montréal from June 25 to 28, 2018.
More details


Scholarships and financial support for graduate students
ReSMiQ financial support
More details

International internship scholarship
Contact É. Legua ( for details

Financial support for conference participant
More details

SIGNAL is the main monthly information medium of the Microsystems Strategic Alliance of Québec (ReSMiQ). This newsletter aims to be an active link between the members of ReSMiQ and all individuals who have an interest in research and innovation in microsystems. We commit ourselves to promote in it our members’ research and increase ReSMiQ’s visibility.

ReSMiQ is a group of researchers in an interuniversity research center that can count on the support of the Fonds de recherche du Québec – Nature et technologies (FRQNT) and nine (9) Quebec universities involved in microsystems research.

Posted in Uncategorized


Call for contributions

12th NAMIS international Autumn school,
from september 10 to 14, 2018, Seattle, USA.

Submission deadline : May 18, 2018.
More details

Conference on Design and Architectures for Signal and Image Processing (DASIP),
du 9 au 12 octobre 2018, Porto, Portugal.
Submission deadline : May 25, 2018.
More details

IEEE Biomedical Circuits and Systems Conference (BioCAS2018),
from October 17 to 19, 2018, Cleveland, U.S.A.
Submission deadline : June 11, 2018.
More details

IEEE Life Science Conference (LSC2018),
from October 28 to 30, 2018, Montréal, Canada

Submission deadline : June 4, 2018.
More details

Call for participation

31st Canadian Conference on Electrical & Computer engineering (CCECE),
from May 13 to 16, 2018, Québec, Canada.
More details

2018 International Symposium on Circuits and Systems (ISCAS),
from May 27 to 30, 2018, Florence, Italy.

More details

16th IEEE International NEWCAS Conference (NEWCAS),
from June 24 to 27, 2018, Montréal, Canada.
More details

The 31st International Conference on Industrial, Engineering & Other Applications of Applied Intelligent Systems (IAE-AIE2018),
from June 25 to 28, 2018, Montréal, Canada.
More details

18th International Forum on MPSoC for Software-defined Hardware (MPSoC’18),
from July 29 to August 3, 2018, Snowbird, UT, USA.

More details

61st IEEE International Midwest Symposium on Circuits and Systems (MWSCAS),
from August 5 to 8, 2018, Windsor, ON, Canada.
More details

12th International Conference on Verification and Evaluation of Computer and Communication Systems (VECoS 2018),
du 26 au 28 septembre 2018, Grenoble, France.

Plus de détails

XXXIII  Conference on design of circuits and integrated systems (DCIS),
from November 14 to 16, 2018, Lyon, France.
More details


Prof. Giovanni Beltrame
Polytechnique Montréal
Member of ReSMiQ since 2012

Giovanni Beltrame received the Ph.D. degree in computer engineering from the Politecnico di Milano, Italy. He worked as a microelectronic engineer at the European Space Agency, Noordwijk, Netherlands, where he was involved in a number of projects spanning from radiation-tolerant systems to computer-aided design. Currently, Prof. Beltrame is an Associate Professor and Director of the MIST Laboratory in the Department of Computer and Software Engineering, Polytechnique de Montréal, QC, Canada. His current research interests are in high-performance data systems for aerospace, design methodologies for adaptive and self-optimizing systems, optimization, artificial intelligence, robotics, and space systems in general. Prof. Beltrame has authored or co-authored more than 60 refereed papers in international conferences and journals. He is in the organizing committee of several international conferences, and he is the principal investigator on multiple projects funded by government and industry.

More details

Below is a selection of publications in recent years followed by representative work.

  1. Chao Chen and Giovanni Beltrame. An adaptive Markov model for the timing analysis of probabilistic caches. Design Automation of Embedded Systems, ACM Transactions on, 2017.
  2. Jacopo Panerati, Luca Giovanni Gianoli, Carlo Pinciroli, Gabriela Nicolescu, Abdo Shabah, and Giovanni Beltrame. From swarms to stars: task coverage in robot swarms with connectivity constraints. Autonomous Robots, 2017.
  3. Guannan Li, David St-Onge, Carlo Pinciroli, Andrea Gasparri, Emanuele Garone, and Giovanni Beltrame. Decentralized progressive shape formation with robot swarms. Autonomous Robots, 2017.
  4. Rabeh Ayari, Imane Hafnaoui, Alexandra Aguiar, Patricia Gilbert, Michel Galibois, Jean-Pierre Rousseau, Giovanni Beltrame, and Gabriela Nicolescu. Multi-objective mapping of full-mission simulators on heterogeneous distributed multi-processor systems. The Journal of Defense Modeling and Simulation: Applications, Methodology, Technology, 2016.
  5. Alain Fourmigue, Giovanni Beltrame, and Gabriela Nicolescu. Transient thermal simulation of liquid-cooled 3D ICs. Components, Packaging and Manufacturing Technology, IEEE Transactions on, 6(9):1349–1360, 2016.
  6. Carlo Pinciroli and Giovanni Beltrame. Buzz: a programming language for robot swarms. IEEE Software, 33(4):97–100, July/August 2016.
  7. Carlo Pinciroli and Giovanni Beltrame. Swarm-oriented programming of distributed robot networks. IEEE Computer, 49(12):32–41, December 2016. Cover Feature.
  8. Chao Chen, Jacopo Panerati, and Giovanni Beltrame. Probabilistic timing analysis of random caches with fault detection mechanisms. IEEE Transactions on Emerging Topics in Computing, 2016.


Transient Thermal Simulation of Liquid-Cooled 3-D Circuits

The 3-D integrated circuits (3-D ICs) are emerging as a viable solution to enhance the performance of many-core platforms. These architectures generate a high and rapidly changing thermal flux that makes conventional air-cooled devices more susceptible to overheating. Liquid cooling is an alternative that can improve dissipation and reduce thermal issues. Fast and accurate thermal models are needed to appropriately dimension the cooling system at design time. Several models have been proposed to study different designs, but generally with low simulation performance. In this paper, we present an efficient model of the transient thermal behavior of liquid-cooled 3-D ICs. This paper presents an approach with extremely low memory usage and advanced numerical methods to efficiently compute the transient temperature of 3-D ICs. Our experiments show the 100x speedup versus the state-of-the-art models, while maintaining the same level of accuracy, and demonstrate the efficiency of liquid cooling to remove the heat from 3-D many-core platforms.

Fig. 1. A typical 3-D IC with microchannel cooling made of several stacked dies with the microchannels etched into the silicon bulk of one or more dies.

Fig. 2. Temperature evolution of die for a liquid-cooled versus air-cooled system. The simulation shows that the air-cooled heat sink fails to remove the high heat flux generated by the target structure.