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September 2017 edition – Vol.9 no.7

Posted on by Eric Legua

EDITORIAL

You are cordially invited to participate in the next ReSMiQ Innovation Day on October 12, 2017, at Polytechnique Montréal. This activity, organized by our center, aims to provide visibility to the research work of students from Quebec in the field of microsystems among the members of the scientific community Québec. The call for projects announced across the province of Québec has resulted in the selection of a total of 16 projects, 2 from undergraduate students and 14 from graduate students.

The candidates for the competition will demonstrate their scientific and technical expertise to a panel of judges composed of many experts. The best 3 projects in both categories will receive a cash award. RID 2017 will also be an excellent opportunity to attend keynote presentations by two renowned speakers such as Jose M. de la Rosa from the Universidad de Sevilla and Hao Yu from the Southern University of Science and Technology in Shenzhen in China. We thank all of the students who submitted their project. We invite you to visit our web site (www.resmiqinnove.ca) for more details.

ReSMiQ is a group of researchers in an interuniversity research center that can count on the support of the Fonds de recherche du Québec – Nature et technologies (FRQNT) and nine (9) Quebec universities involved in microsystems research.

NEWS FROM OUR MEMBERS

Involvment
– Dr. Peter from Polytechnique Montréal is the program co-chair of the Conference on Optical MEMS and Nanophotonics 2018 (OMN) to be held in Lausanne, Swizterland, on the campus of the EPFL from July 29 to August 2, 2018.
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– Dr. Ait Mohamed from Concordia is the general co-chair of The 31st International Conference on Industrial, Engineering & Other Applications of Applied Intelligent Systems (IAE/AIE) to be held in Montréal from June 25 to 28, 2018.
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RESMIQ’S ACTIVITIES

Scholarships and financial support for graduate students
ReSMiQ financial support
APPLICATION DEADLINE: October 16, 2017
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International internship scholarship
APPLICATION DEADLINE: October 9, 2017
Contact É. Legua (eric.legua@polymtl.ca) for details

Financial support for conference participant
APPLICATION DEADLINE: October 30, 2017
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SIGNAL is the main monthly information medium of the Microsystems Strategic Alliance of Québec (ReSMiQ). This newsletter aims to be an active link between the members of ReSMiQ and all individuals who have an interest in research and innovation in microsystems. We commit ourselves to promote in it our members’ research and increase ReSMiQ’s visibility.

ReSMiQ is a group of researchers in an interuniversity research center that can count on the support of the Fonds de recherche du Québec – Nature et technologies (FRQNT) and nine (9) Quebec universities involved in microsystems research.

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UPCOMING CONFERENCES

2023 International Conference on Microelectronics (ICM)
from December 17 to 20, 2023, Abu Dhabi, United Arab Emirates.
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2023 IEEE 11th International Conference on Systems and Control (ICSC)
from December 18 to 20, 2023, Sousse, Tunisia.
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2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID)
from January 6 to 10, 2024, Kolkata, India.
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2024 IEEE International Solid-State Circuits Conference (ISSCC)
from February 18 to 22, 2024, San Francisco, California, USA.
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2024 IEEE 15th Latin America Symposium on Circuits and Systems (LASCAS)
from February 27 to March 1, 2024, Punta del Este, Uruguay.
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2024 IEEE Custom Integrated Circuits Conference (CICC)
from April 21 to 24, 2024, Denver, Colorado, USA.
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2024 IEEE 6th International Conference on AI Circuits and Systems (AICAS)
from April 22 to 25, 2024, Abu Dhabi, United Arab Emirates.
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2024 9th International Conference on Integrated Circuits, Design, and Verification (ICDV)
from June 6 to 7, 2024, Hanoi, Vietnam.
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2024 61st ACM/IEEE Design Automation Conference (DAC)
from June 23 to 27, 2024, San Francisco, California, USA.
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2024 IEEE International Conference on Multimedia and Expo (ICME)
from July 15 to 19, 2024, Niagara Falls, Ontario, Canada.
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MEMBER PROFILE

Prof. Giovanni Beltrame
Polytechnique Montréal
Member of ReSMiQ since 2012

Giovanni Beltrame received the Ph.D. degree in computer engineering from the Politecnico di Milano, Italy. He worked as a microelectronic engineer at the European Space Agency, Noordwijk, Netherlands, where he was involved in a number of projects spanning from radiation-tolerant systems to computer-aided design. Currently, Prof. Beltrame is an Associate Professor and Director of the MIST Laboratory in the Department of Computer and Software Engineering, Polytechnique de Montréal, QC, Canada. His current research interests are in high-performance data systems for aerospace, design methodologies for adaptive and self-optimizing systems, optimization, artificial intelligence, robotics, and space systems in general. Prof. Beltrame has authored or co-authored more than 60 refereed papers in international conferences and journals. He is in the organizing committee of several international conferences, and he is the principal investigator on multiple projects funded by government and industry.

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Below is a selection of publications in recent years followed by representative work.

  1. Chao Chen and Giovanni Beltrame. An adaptive Markov model for the timing analysis of probabilistic caches. Design Automation of Embedded Systems, ACM Transactions on, 2017.
  2. Jacopo Panerati, Luca Giovanni Gianoli, Carlo Pinciroli, Gabriela Nicolescu, Abdo Shabah, and Giovanni Beltrame. From swarms to stars: task coverage in robot swarms with connectivity constraints. Autonomous Robots, 2017.
  3. Guannan Li, David St-Onge, Carlo Pinciroli, Andrea Gasparri, Emanuele Garone, and Giovanni Beltrame. Decentralized progressive shape formation with robot swarms. Autonomous Robots, 2017.
  4. Rabeh Ayari, Imane Hafnaoui, Alexandra Aguiar, Patricia Gilbert, Michel Galibois, Jean-Pierre Rousseau, Giovanni Beltrame, and Gabriela Nicolescu. Multi-objective mapping of full-mission simulators on heterogeneous distributed multi-processor systems. The Journal of Defense Modeling and Simulation: Applications, Methodology, Technology, 2016.
  5. Alain Fourmigue, Giovanni Beltrame, and Gabriela Nicolescu. Transient thermal simulation of liquid-cooled 3D ICs. Components, Packaging and Manufacturing Technology, IEEE Transactions on, 6(9):1349–1360, 2016.
  6. Carlo Pinciroli and Giovanni Beltrame. Buzz: a programming language for robot swarms. IEEE Software, 33(4):97–100, July/August 2016.
  7. Carlo Pinciroli and Giovanni Beltrame. Swarm-oriented programming of distributed robot networks. IEEE Computer, 49(12):32–41, December 2016. Cover Feature.
  8. Chao Chen, Jacopo Panerati, and Giovanni Beltrame. Probabilistic timing analysis of random caches with fault detection mechanisms. IEEE Transactions on Emerging Topics in Computing, 2016.

RESEARCH CONTRIBUTIONS

Transient Thermal Simulation of Liquid-Cooled 3-D Circuits

The 3-D integrated circuits (3-D ICs) are emerging as a viable solution to enhance the performance of many-core platforms. These architectures generate a high and rapidly changing thermal flux that makes conventional air-cooled devices more susceptible to overheating. Liquid cooling is an alternative that can improve dissipation and reduce thermal issues. Fast and accurate thermal models are needed to appropriately dimension the cooling system at design time. Several models have been proposed to study different designs, but generally with low simulation performance. In this paper, we present an efficient model of the transient thermal behavior of liquid-cooled 3-D ICs. This paper presents an approach with extremely low memory usage and advanced numerical methods to efficiently compute the transient temperature of 3-D ICs. Our experiments show the 100x speedup versus the state-of-the-art models, while maintaining the same level of accuracy, and demonstrate the efficiency of liquid cooling to remove the heat from 3-D many-core platforms.

Fig. 1. A typical 3-D IC with microchannel cooling made of several stacked dies with the microchannels etched into the silicon bulk of one or more dies.

Fig. 2. Temperature evolution of die for a liquid-cooled versus air-cooled system. The simulation shows that the air-cooled heat sink fails to remove the high heat flux generated by the target structure.