January 2017 edition – Vol.9 no.1

Posted on January 27, 2017 by

EDITORIAL

ReSMiQ is a group of researchers in an interuniversity research center that can count on the support of the Fonds de recherche du Québec – Nature et technologies (FRQNT) and nine (9) Quebec universities involved in microsystems research. ReSMiQ is proud to have been a contributing partner for the 10^th edition of the École Francophone sur les Technologies de Conception des Systèmes Embarqués Hétérogènes (FETCH 2017), held between January 9 and 11, 2017 in Mont-Tremblant, for a 4th time in Canada, after Ottawa (2014), Québec City (2011) and Montebello (2008). Nearly 40 participants attended the numerous presentations programed, including 6 students affiliated to ReSMiQ who presented their most recent research work.

FETCH2017 From left to right: Sylvain Martel, Gabriela Nicolescu, Guy Bois, Giovanni Beltrame and Luc Fréchette.

NEWS FROM OUR MEMBERS

Exposure
– Dr. Martel from Polytechnique Montréal is in the running for the 24th edition of the Québec Science Magazine Competition for its work on nanorobotic agents that precisely target cancerous tumors, among the 10 Québec discoveries of the year.
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– Dr. Gosselin from Université Laval gave a presentation at FETCH2017 during a session on biomedical systems.

– Dr. Nicolescu from Polytechnique Montréal gave a keynote speech on modeling and thermal simulation of SoCs at FETCH2017.

– Dr. Fréchette from Université de Sherbrooke gave a presentation at FETCH2017 during a session on new technologies and communications.

– Dr. Bois from Polytechnique Montréal gave a presentation at FETCH2017 during a session on architectures and design flow.

– Dr. Beltrame from Polytechnique Montréal gave a presentation at FETCH2017 during a session security, verification and robustness.

– Dr. Martel from Polytechnique Montréal gave a keynote speech on electronic platforms to fight cancer at FETCH2017.

Achievement

– Dr. Ajib is the author of a publication that won the best paper award at the WiMob 2016 conference.
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– Dr. Fontaine and Pratte from Université de Sherbrooke are supervising Marc-André Tétrault at the Ph.D., recipient of the IEEE Radiation Instrumentation Early Career Award, bestowed in Strasbourg during the most recent edition of the IEEE Nuclear Science Symposium & Medical Imaging Conference.

– Dr. Fréchette from Université de Sherbrooke is supervising Albert Tessier-Poirrier and Thomas Monin at the Ph.D., recipients of the second place poster award, bestowed in Paris during the most recent edition of the PowerMEMS conference.

– Dr. Fontaine and Pratte from Université de Sherbrooke are supervising Audrey Corbeil Therrien who won the first place at the poster competition of the Nuclear Science Symposium.

– Dr. Fontaine and Pratte from Université de Sherbrooke are supervising Émilie Gaudin who won the second place at the poster competition of the Medical imaging Conference.

– Dr. Gosselin from Université Laval received a collaborative research and development grant from NSERC with Prompt Québec and Kinova for a new body-machine multi-mode wireless interface.

– Dr. Fréchette from Université de Sherbrooke received a strategic partnership grant from NSERC for Thermotronics for zero-power continuous monitoring wireless sensors with Teledyne DALSA Semiconductor Inc.

Implication
– Dr. Boukadoum from UQAM is TPC co-chair of the 30^th annual IEEE Canadian Conference on Electrical and Computer Engineering to be held in Windsor, Ontario from April 30 to May 3, 2017.
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RESMIQ’S ACTIVITIES

Financial support for undergraduate students
APPLICATION DEADLINE: March 1, 2017
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Financial support for conference participants
APPLICATION DEADLINE: March 1, 2017
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SIGNAL is the main monthly information medium of the Microsystems Strategic Alliance of Québec (ReSMiQ). This newsletter aims to be an active link between the members of ReSMiQ and all individuals who have an interest in research and innovation in microsystems. We commit ourselves to promote in it our members’ research and increase ReSMiQ’s visibility.

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2023 International Conference on Microelectronics (ICM)
from December 17 to 20, 2023, Abu Dhabi, United Arab Emirates.
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2023 IEEE 11th International Conference on Systems and Control (ICSC)
from December 18 to 20, 2023, Sousse, Tunisia.
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2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID)
from January 6 to 10, 2024, Kolkata, India.
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2024 IEEE International Solid-State Circuits Conference (ISSCC)
from February 18 to 22, 2024, San Francisco, California, USA.
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2024 IEEE 15th Latin America Symposium on Circuits and Systems (LASCAS)
from February 27 to March 1, 2024, Punta del Este, Uruguay.
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2024 IEEE Custom Integrated Circuits Conference (CICC)
from April 21 to 24, 2024, Denver, Colorado, USA.
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2024 IEEE 6th International Conference on AI Circuits and Systems (AICAS)
from April 22 to 25, 2024, Abu Dhabi, United Arab Emirates.
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2024 9th International Conference on Integrated Circuits, Design, and Verification (ICDV)
from June 6 to 7, 2024, Hanoi, Vietnam.
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2024 61st ACM/IEEE Design Automation Conference (DAC)
from June 23 to 27, 2024, San Francisco, California, USA.
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2024 IEEE International Conference on Multimedia and Expo (ICME)
from July 15 to 19, 2024, Niagara Falls, Ontario, Canada.
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Prof. Roni Khazaka
McGill University
Member of ReSMiQ since 2005

Roni Khazaka received his Ph.D. degree in Electrical Engineering from Carleton University, Ottawa, Canada. He currently is an Associate Professor in the Department of Electrical and Computer Engineering at McGill University, Montreal, QC, Canada. His research interests are in the development of methodologies and algorithms for the design and design automation of high-speed circuits. This includes novel approaches for the steady state simulation of nonlinear circuits, non-linear distortion analysis of RF ICs, modeling and simulation of high-speed interconnects, and FPGA based hardware acceleration methods. Dr. Khazaka served as Chair of the IEEE Montreal section. He is a senior IEEE member and has also served on several IEEE committees. He was the IEEE Montreal section Treasurer, the student activities coordinator and. He is a member of the Technical Program Committee of Signal Propagation on Interconnects Workshop, and he was the track co-chair of MWCAS/ NEWCAS 2007. Currently he is a member of the ReSMiQ Executive Committee. More details

Below is a selection of publications in recent years followed by representative work.

M. Kassis, Y. Q. Xiao, M. Kabir and R. Khazsaka, “Passive Reduced Order Macromodeling based on Loewner Matrix Interpolation”, IEEE Trans. Microwave Theory Tech., Pages 2423- 2432, August 2016.
Yi Qing Xiao, Muhammad Kabir and R. Khazaka "Passivity Enforcement using Incomplete Complex Frequency Hopping" Accepted in IEEE Conference on Electrical Performance of Electronic Packaging and Systems EPEPS, Oct 2016.
Y. Q. Xiao, M. Kabir, M. Kassis and R. Khazaka "Passive Reduced Order Macromodeling Based on Admittance Parameter Using Hamiltonian-Symplectic Matrix Pencil Perturbation" IEEE International Conference on Ubiquitous Wireless Broadband ICUWB, Oct. 2015.
M. T. Kassis, M. Kabir and R. Khazaka "Passive Reduced Order Macromodeling Using Hamiltonian Matrix Pencil Perturbation" IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization NEMO, Aug. 2015.
N. D. Abou Ziki and R. Khazaka "Steady-State Simulation Based on A- and L-Stable High Order Time-Domain Integration Method for RF Applications" IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization NEMO, Aug. 2015.
M. Ahadi, M. Kabir, S. Roy and R. Khazaka "Fast Multidimensional Statistical Analysis of Microwave Networks via Stroud Cubature Approach" IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization NEMO, Aug. 2015.
M. Dolatsara, M. Kabir, E. Chobanyan, A Smull, S. Roy, B. Notaros, M. A. Talukder and R. Khazaka “Non-Intrusive Pseudo Spectral Approach for Stochastic Macromodeling of EM Systems using Deterministic Full-wave Solvers” IEEE Conference on Electrical Performance of Electronic Packaging and Systems EPEPS, Oct 2014. Best student Paper Award.

Passive Reduced Order Macromodeling Based on Loewner Matrix Interpolation

Loewner matrix (LM) interpolation-based macromodeling methods can generate an accurate macromodel for large and complex structures. However, there is less flexibility in the choice of the macromodel order due to the need to ensure passivity. In this paper, an algorithm is proposed to obtain a reduced order model based on LM interpolation while still maintaining the passivity of the macromodel. This is achieved by first relaxing the passivity requirement during the order selection process; then a new passivity enforcement scheme with significantly improved speed and convergence properties is applied. The proposed approach results in a significantly reduced macromodel size while maintaining accuracy and passivity conditions. The efficiency and the scalability of the proposed approach are illustrated by using four numerical examples: three noise-free examples. The results are compared with algorithms proposed in literature. A higher order reduction with better efficiency in terms of computational cost is demonstrated, particularly for both noise-free data and full-wave data subject to discretization noise.

Fig. 1. Example of a 30-port multilayer 3-D high-speed structure containing stacked striplines and microstriplines. ANSYS HFSS 2014 is used to compute the S-parameter data spanning the bandwidth from 0.05 to 10 GHz. While the passivity enforcement algorithm reported in literature can enforce the passivity of the model obtained from the noise-free data, it fails to enforce passivity of the model obtained from the full-wave data subject to discretization noise due to the passivity violation at DC (f = 0 Hz). However, the proposed algorithm can enforce such a passivity violation. The results for this example are summarized below.

Fig. 2. Magnitude of a sample S-parameter data for the full-wave example

Table I. Simulation Results for the Full-Wave Example

January 2017 edition – Vol.9 no.1

EDITORIAL

NEWS FROM OUR MEMBERS

RESMIQ’S ACTIVITIES

UPCOMING CONFERENCES

MEMBER PROFILE

RESEARCH CONTRIBUTIONS