January 2016 edition – Vol.8 no.1

2023 International Conference on Microelectronics (ICM)
from December 17 to 20, 2023, Abu Dhabi, United Arab Emirates.
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2023 IEEE 11th International Conference on Systems and Control (ICSC)
from December 18 to 20, 2023, Sousse, Tunisia.
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2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID)
from January 6 to 10, 2024, Kolkata, India.
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2024 IEEE International Solid-State Circuits Conference (ISSCC)
from February 18 to 22, 2024, San Francisco, California, USA.
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2024 IEEE 15th Latin America Symposium on Circuits and Systems (LASCAS)
from February 27 to March 1, 2024, Punta del Este, Uruguay.
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2024 IEEE Custom Integrated Circuits Conference (CICC)
from April 21 to 24, 2024, Denver, Colorado, USA.
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2024 IEEE 6th International Conference on AI Circuits and Systems (AICAS)
from April 22 to 25, 2024, Abu Dhabi, United Arab Emirates.
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2024 9th International Conference on Integrated Circuits, Design, and Verification (ICDV)
from June 6 to 7, 2024, Hanoi, Vietnam.
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2024 61st ACM/IEEE Design Automation Conference (DAC)
from June 23 to 27, 2024, San Francisco, California, USA.
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2024 IEEE International Conference on Multimedia and Expo (ICME)
from July 15 to 19, 2024, Niagara Falls, Ontario, Canada.
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Prof. Benoit Gosselin
Université Laval
Member of ReSMiQ since 2011

Benoit Gosselin obtained the Ph.D. degree in Electrical Eng. from École Polytechnique de Montréal in 2009, and he was an NSERC Postdoctoral Fellow at the Georgia Institute of Technology in 2010. He is currently an Associate Professor at the Depart. of ECE at Université Laval, where he is heading the Biomedical Microsystems Lab. His research interests include wireless microsystems for brain computer interfaces, analog/mixed-mode and RF integrated circuits for neural engineering, interface circuits of implantable sensors/actuators and point-of-care diagnostic microsystems for personalized healthcare. Dr Gosselin is an Associate Editor of the IEEE Transactions on Biomedical Circuits and Systems and he is Chair and Founder of the Quebec IEEE CAS/EMB Chapter (2015 Best New Chapter Award). He served on the committees of several int’l conferences such as IEEE BIOCAS, IEEE NEWCAS, IEEE EMBC/NER, and IEEE ISCAS, and he currently serves on the committees of the IEEE ISCAS’16 and the IEEE NEWCAS’16. His research consists of developing innovative microelectronic platforms to collect and study brain activity through advanced multimodal bioinstrumentation and actuation technology. In addition to earn several awards, such as the 2015 Mitacs Award for Outstanding Innovation – Master’s and the IEEE BioCAS’15 Best paper award, his contributions led to the commercialization by Doric Lenses of the first wireless electronic implant to combine optogenetics and large-scale brain monitoring capabilities within a single device. More details

Below is a selection of publications in recent years followed by representative work.

1. E. Porter, H. Bahrami, A. Santorelli, B. Gosselin, L. A. Rusch, and M. Popović, “A Wearable Microwave Antenna Array for Time-Domain Breast Tumor Screening,” IEEE Transactions on Medical Imaging, 2016, PMID: 26780788.

2. S. A. Mirbozorgi, H. Bahrami, M. Sawan, L. Rusch, and B. Gosselin, “A Single-Chip Full-Duplex High Speed Transceiver for Multi-Site Stimulating and Recording Neural Implants,” IEEE Transactions on Biomedical Circuits and Systems, 2015, PMID: 26469635.

3. H. Bahrami, S.A. Mirbozorgi, L. A. Rusch, and B. Gosselin, “Flexible Polarization-Diverse UWB Antennas for Implantable Neural Recording Systems,” IEEE Transactions on Biomedical Circuits and Systems, 2015, PMID: 25794394.

4. G. Gagnon-Turcotte, A. Avakh, R. Ameli, C.-O. Dufresne, Y. LeChasseur, J.-L. Neron, P. Brule Bareil, Paul Fortier, Cyril Bories, Yves De Koninck, and B. Gosselin, “A Wireless Optogenetic Stimulator Headstage with Multichannel Electrophysiological Recording Capability,” Sensors, vol. 15, no. 9, pp. 22776-22797, 2015.

5. H. Bahrami, S.A. Mirbozorgi, L. A. Rusch, and B. Gosselin, “Biological Channel Modeling and Implantable UWB Antenna Design for Neural Recording Systems,” IEEE Transactions on Biomedical Engineering, vol. 62, pp. 88-98, 2014.

6. S. A. Mirbozorgi, H. Bahrami, M. Sawan, and B. Gosselin, “A Smart Multicoil Inductively-coupled Array for Wireless Power Transmission,” IEEE Transactions on Industrial Electronics, vol. 61, pp. 6061–6070, 2014.

7. H. Park, M. Kiani, H.-M. Lee, J. Kim, J. Block, B. Gosselin, and M. Ghovanloo, "A Wireless Magnetoresistive Sensing System for an Intraoral Tongue-Computer Interface," IEEE Transactions on Biomedical Circuits and Systems, vol. 6, pp. 571-585, 2012.

8. B. Gosselin, "Recent Advances in Neural Recording Microsystems," Sensors, vol. 11, pp. 4572-4597, 2011.

A Single-Chip Full-Duplex High Speed Transceiver for
Multi-Site Stimulating and Recording Neural Implants

We present a novel, fully-integrated, low-power full-duplex transceiver (FDT) to support high-density and bidirectional neural interfacing applications (high-channel count stimulating and recording) with asymmetric data rates: higher rates are required for recording (uplink signals) than stimulation (downlink signals). The transmitter (TX) and receiver (RX) share a single antenna to reduce implant size and complexity. The TX uses impulse radio ultra-wide band (IR-UWB) based on an edge combining approach, and the RX uses a novel 2.4-GHz on-off keying (OOK) receiver. Proper isolation (>20 dB) between the TX and RX path is implemented 1) by shaping the transmitted pulses to fall within the unregulated UWB spectrum (3.1-7 GHz), and 2) by space-efficient filtering (avoiding a circulator or diplexer) of the downlink OOK spectrum in the RX low-noise amplifier. The UWB 3.1-7 GHz transmitter can use either OOK or binary phase shift keying (BPSK) modulation schemes. The proposed FDT provides dual band 500-Mbps TX uplink data rate and 100 Mbps RX downlink data rate, and it is fully integrated into standard TSMC 0.18-μm CMOS within a total size of 0.8 mm2. The total measured power consumption is 10.4 mW in full duplex mode (5 mW at 100 Mbps for RX, and 5.4 mW at 500 Mbps or 10.8 pJ/bit for TX). Additionally, a 3-coil inductive link along with on-chip power management circuits allows to powering up the implantable transceiver wirelessly by delivering 25 mW extracted from a 13.56-MHz carrier signal, at a total efficiency of 41.6%.

Fig. 1. Block diagram of an implantable neural recording and stimulating device including an inductive power link and the proposed full duplex transceiver.

Fig. 2. The integrated circuit building blocks of the proposed implantable wireless interface consists of a new full duplex data transceiver (UWB high data rate transmitter and 2.4 GHz receiver) and a power recovery unit including two voltage regulators (VDD=1.2/1.8V) and a voltage rectifier. The chip includes a versatile OOK/BPSK (Transmitter1) and a compact size simplified OOK transmitter (Transmitter2), which performances are compared throughout the paper.